HWK Release Update HWK_Suite_Minor_v02.08.002
HWK_Suite_Minor_v02.08.002 Release Date: 10/02/2009
1. Flash Update Pack problems Fixed.
2. New BB5 products:
3. DC4 Flash Chip 0020883C Fixed.
4. New DCT4 products:
5. New DCT4+ UNL versions support:
1200(RH-99 v5.71,v5.80) 1202(RH-112 v2.80) 1208(RH-105 v5.71,v5.80)
6. User interface localisation.
Do not use external VPP adapter with RX2 enabled cables, since this will put VPP direct to RX2 and its possible to KILL the phone.
LG_GSM V 220.127.116.11
1. Infineon GB100,GB105,GB106,KG285,KG288,KP100,KP105,KP106,KP 107
support added. (BIN bundle files open as FLS)
2. Read/Write for Infineon EGOLD Voice added.
3. Auto Backup for Infineon EGOLD Voice added.
4. ADI KF240, KF300
support added. (BIN bundle files open as Code)
Cable as for KP130,KP210,KP260
5. QualComm models introduced.
SAMs V 18.104.22.168
B270 added (DUNL,IM,FL)
J610 MSL corrected (DUNL,IM)
E215L,M320L added (CUNL,FL)
(Use [Reset MMI] if phone ask for password)
M140 added (DUNL,IM,FL,SECT)
J706,L708E added (DUNL,IM,FL,SECT)
B130,B130S,B130T fixed flashing for HW 0.600
ENUMERATION NOT EXIST: 20 bug fixed (up to COM256 supported)
Fixed flashing for OEMSBL V5.32 and higher (M7500,M8800)
UNLOCK and UNFREEZE added for these models:
(Use [QCDI Info] button to readout keys)
Samsung / Qualcomm USB Drivers can be downloaded here:-
We would like for some users to add localisation in their own native language to the software, localisation is added to SAMs only at the moment but will be added to other modules in future.
1. Only 1 contributer per language.
2. You must know how to use the software and what each function does.
3. The chosen language is your native language or you are fluent in the selected language, for example Chinese is not my native language and I would like someone to take over from me and finish/correct as required.